Process Hierarchy

If you are interested in this process, either by itself or as part of a longer processing sequence, please send us email at engineering@mems-exchange.org or call us at (703) 262-5368
on front
  Spectrophotometric film thickness measurement #1
Batch size 1
Materials photoresist (negative) (category), photoresist (negative) on silicon dioxide, photoresist (positive) (category), photoresist (positive) in silicon dioxide, polyimide (category), polysilicon on silicon dioxide, silicon dioxide, silicon nitride, silicon nitride on silicon dioxide
Process duration 30 min
Refractive index 0 .. 4
Sides processed either
Thickness 0.005 .. 50 µm
Wafer size
Wafer size
Equipment NanoSpec/AFT Model 010-180
Equipment characteristics:
Wafer holder
Device that holds the wafers during processing.
 recessed platen
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 silicon
Wafer thickness
List or range of wafer thicknesses the tool can accept
 200 .. 1000 µm